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NSVT489AMT1G - onsemi

Description: Low VCE(sat) Switching Transistor; Pb-Free Package is Available; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
NSVT489AMT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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3D Models
NSVT489AMT1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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NSVT489AMT1G Details

  • Manufacturer Part Number:

    NSVT489AMT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    1.75 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

NSVT489AMT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • The NSVT489AMT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.
  • Yes, the NSVT489AMT1G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application.
  • The recommended soldering conditions for the NSVT489AMT1G include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that follows the IPC J-STD-020 standard.

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NSVT489AMT1G Overview

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