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NT2H1311F0DTLH - NXP

Description: NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection

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PCB Footprints
NT2H1311F0DTLH - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - NTAG213F
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3D Models
NT2H1311F0DTLH - NXP  - 3D model - Small Outline No-lead - NTAG213F
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NT2H1311F0DTLH Details

  • Manufacturer Part Number:

    NT2H1311F0DTLH

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    HXSON-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT1312-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Boundary Scan:

    NO

  • Communication Protocol:

    ASYNC, BIT

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT2H1311F0DTLH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor junction temperature (Tj) and ensure it stays within the recommended range (typically <150°C).
  • Implement ESD protection diodes (e.g., TVS or Zener diodes) on sensitive pins, and ensure a low-impedance path to ground. Use ESD-resistant components and follow proper handling and storage procedures.
  • Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 100nF and 10uF) placed close to the device. Ensure a low-inductance path to the power supply and use a solid ground plane.
  • Use controlled impedance traces, minimize signal routing, and avoid vias and stubs. Implement differential signaling, and consider using a signal integrity analysis tool to optimize your design.

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NT2H1311F0DTLH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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