Part Image

NT2H1611F0DTLH - NXP

Description: NXP - NT2H1611F0DTLH - NFC TAG READER, 13.56MHZ, HXSON-4

Download NT2H1611F0DTLH Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NT2H1611F0DTLH - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - HXSON4
click to zoom
3D Models
NT2H1611F0DTLH - NXP  - 3D model - Small Outline No-lead - HXSON4
click to zoom

NT2H1611F0DTLH Details

  • Manufacturer Part Number:

    NT2H1611F0DTLH

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Package Description:

    HXSON-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT1312-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Boundary Scan:

    NO

  • Communication Protocol:

    ASYNC, BIT

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT2H1611F0DTLH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Use controlled impedance traces, add series termination resistors, and consider using a signal integrity tool to simulate and optimize the design.
  • Power up the device in the following sequence: VDD, VDDQ, and finally VREF. Ensure that VDD and VDDQ are powered up simultaneously.
  • Use the device's power management features, such as power gating and dynamic voltage and frequency scaling, to optimize power consumption. Refer to the datasheet for specific register settings and programming guidelines.
  • Use shielding, filtering, and grounding techniques to minimize EMI. Ensure that the device is placed in a shielded enclosure, and use EMI filters on the I/O lines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NT2H1611F0DTLH Overview

Use the download button to access the NT2H1611F0DTLH schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NT2H1, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to NT2H1611F0DTLH

Showing 0 results