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NT3H2111W0FT1 - NXP

Description: Plastic small outline package; 8 leads; body width 3.9 mm, 1k bytes memory; 50 pF input capacitance; 1000 pcs. on 7'' reel

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PCB Footprints
NT3H2111W0FT1 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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3D Models
NT3H2111W0FT1 - NXP  - 3D model - Small Outline Packages - SO8
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NT3H2111W0FT1 Details

  • Manufacturer Part Number:

    NT3H2111W0FT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLERS

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NT3H2111W0FT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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