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NT3H2111W0FT1X - NXP

Description: RFID Transponders NTAG I C <i>plus</i> 1K, NFC Forum Type 2 Tag with I C interface optimized for entry-level NFC applications

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NT3H2111W0FT1X - NXP PCB footprint - Small Outline Packages - Small Outline Packages - NT3H2111W0FT1X
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NT3H2111W0FT1X Details

  • Manufacturer Part Number:

    NT3H2111W0FT1X

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H2111W0FT1X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Critical timing parameters include the input rise and fall times (tr and tf), clock-to-output delay (tcko), and output hold time (th). Refer to the datasheet for specific values.
  • Implement ESD protection using external components, such as TVS diodes or ESD arrays, and follow proper PCB design guidelines to minimize ESD risk.
  • Power sequencing is critical. Ensure that the core voltage (VDD) is applied before the input voltage (VIN), and that the input voltage is stable before applying the clock signal.

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NT3H2111W0FT1X Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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