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NT3H2111W0FTTJ - NXP

Description: NXP - NT3H2111W0FTTJ - NTAG I- C <I>PLUS</I> 1K, NFC FORUM TYPE 2 TAG WITH I- C INTERFACE OPTIMIZED FOR ENTRY-LEVEL NFC APPLICATIONS, REEL 13" Q1 NDP,

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NT3H2111W0FTTJ - NXP - PCB symbol
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PCB Footprints
NT3H2111W0FTTJ - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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3D Models
NT3H2111W0FTTJ - NXP - 3D model - Small Outline Packages - TSSOP8
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NT3H2111W0FTTJ Details

  • Manufacturer Part Number:

    NT3H2111W0FTTJ

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.2

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H2111W0FTTJ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation.
  • Implement a thermal management strategy, such as heat sinks or thermal interfaces, to keep the junction temperature below 150°C. Monitor the device's thermal performance and adjust the design accordingly.
  • The NT3H2111W0FTTJ has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use ESD-protective packaging and handling equipment to prevent damage.
  • Yes, the NT3H2111W0FTTJ is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure that your design meets the specific requirements of the target application.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly decoupled and that the input voltage is within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines.

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NT3H2111W0FTTJ Overview

Use the download button to access the NT3H2111W0FTTJ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NT3H2, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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