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NT3H2211W0FHKH - NXP

Description: RFID Transponders NTAG I C <i>plus</i> 2K, Product Longevity Program, NFC Forum Type 2 Tag I C interface for entry-level NFC apps

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Symbol
NT3H2211W0FHKH - NXP - PCB symbol
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PCB Footprints
NT3H2211W0FHKH - NXP PCB footprint - Other - Other - SOT902-3
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3D Models
NT3H2211W0FHKH - NXP - 3D model - Other - SOT902-3
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NT3H2211W0FHKH Details

  • Manufacturer Part Number:

    NT3H2211W0FHKH

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    XQFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT902-3

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • JESD-30 Code:

    S-PQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC8,.07SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H2211W0FHKH Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Use a metal shield or a shielded enclosure to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). Ensure proper grounding and decoupling of the device and surrounding components.
  • Implement power-saving modes, such as dynamic voltage and frequency scaling, and optimize the system's clock frequency and voltage supply. Use the device's built-in power management features, such as the power-down mode.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Ensure the test setup is properly calibrated and isolated from noise sources. Use a logic analyzer or oscilloscope to monitor signal integrity and timing.

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NT3H2211W0FHKH Overview

Use the download button to access the NT3H2211W0FHKH schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NT3H2, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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