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NT3H2211W0FT1X - NXP

Description: RFID Transponders NTAG I C plus 2K, NFC Forum Type 2 Tag with I C interface optimized for entry-level NFC applications

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NT3H2211W0FT1X - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT96-1
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NT3H2211W0FT1X - NXP  - 3D model - Small Outline Packages - SOT96-1
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NT3H2211W0FT1X Details

  • Manufacturer Part Number:

    NT3H2211W0FT1X

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.67 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

NT3H2211W0FT1X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and consider using a thermistor or thermocouple for temperature monitoring.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on I/O lines. Follow NXP's EMI reduction guidelines and consult relevant industry standards.
  • Use the lowest possible voltage supply, optimize clock frequencies, and implement power-saving modes. Consider using a DC-DC converter for efficient power conversion.
  • Perform functional testing, boundary scan testing, and environmental stress testing. Validate the design using NXP's recommended test vectors and validation procedures.

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NT3H2211W0FT1X Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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