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NTB0102DP - NXP

Description: NXP Semiconductors NTB0102DP/TSSOP8///REEL 7 Q3/T4 *STANDARD MARK

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NTB0102DP - NXP - PCB symbol
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PCB Footprints
NTB0102DP - NXP PCB footprint - Small Outline Packages - Small Outline Packages - https://www.digikey.in/en/products/detail/nxp-usa-inc/NTB0102DP-125/3679414-
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3D Models
NTB0102DP - NXP - 3D model - Small Outline Packages - https://www.digikey.in/en/products/detail/nxp-usa-inc/NTB0102DP-125/3679414-
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for NTB0102DP
  • Part Number NTB0102DP
  • Manufacturer NXP
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - https://www.digikey.in/en/products/detail/nxp-usa-inc/NTB0102DP-125/3679414-
  • Released Date Aug 15, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

NTB0102DP Details

  • Manufacturer Part Number:

    NTB0102DP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Delay-Max:

    17.2 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NTB0102DP Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11555, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The NTB0102DP has a thermal pad that must be connected to a thermal ground plane to dissipate heat. Ensure that the thermal pad is connected to a large copper area on the PCB, and consider using thermal vias to improve heat dissipation. Additionally, follow the recommended thermal management guidelines in the datasheet and application notes.
  • The NTB0102DP has an operating temperature range of -40°C to 125°C, but the device can be operated up to 150°C for short periods of time (e.g., during soldering). However, prolonged operation above 125°C may affect the device's reliability and lifespan.
  • The NTB0102DP is designed for high-speed interfaces and has a maximum operating voltage of 3.6V. While it can tolerate some voltage overshoot, it is not designed for high-voltage applications. If you need a device for high-voltage applications, consider using a different part number or consulting with NXP's technical support team.
  • Start by reviewing the datasheet and application notes to ensure that the device is properly configured and used within its recommended operating conditions. Use oscilloscopes and logic analyzers to debug signal integrity issues, and consult NXP's technical support team or online forums for additional guidance and resources.

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NTB0102DP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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