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NTBG020N090SC1 - onsemi

Description: Ultra Low Gate Charge (Qg tot); Low Output Capacitance (Coss); 100% UIL Tested; RoHS Compliant; Low RDSon

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NTBG020N090SC1 - onsemi  - 3D model
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NTBG020N090SC1 Details

  • Manufacturer Part Number:

    NTBG020N090SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK7 (TO-263-7L HV)

  • Package Description:

    D2PAK-7

  • Manufacturer Package Code:

    418BJ

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-10-31

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • Avalanche Energy Rating (Eas):

    264 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    112 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JEDEC-95 Code:

    TO-263CB

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    477 W

  • Pulsed Drain Current-Max (IDM):

    448 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

NTBG020N090SC1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal design for the NTBG020N090SC1 can be found in the onsemi application note AND9093/D, which provides guidelines for thermal management and PCB layout considerations to ensure optimal performance and reliability.
  • When selecting a gate driver for the NTBG020N090SC1, consider the gate charge (Qg) and the desired switching frequency. A gate driver with a high current capability (e.g., 2-4 A) and a low output impedance is recommended. The onsemi gate driver selection guide can help with this process.
  • The safe operating area (SOA) limits for the NTBG020N090SC1 can be found in the onsemi application note AND9095/D, which provides detailed information on the device's SOA and how to ensure reliable operation within the specified limits.
  • To minimize the impact of parasitic inductance and capacitance, use a 4-layer PCB with a solid ground plane, keep the high-current paths short and wide, and use decoupling capacitors close to the device. Additionally, consider using a layout with a low inductance and a controlled impedance to reduce ringing and overshoot.
  • The recommended soldering and assembly techniques for the NTBG020N090SC1 can be found in the onsemi packaging and assembly guidelines document, which provides detailed information on soldering, handling, and assembly procedures to ensure reliable operation and prevent damage to the device.

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NTBG020N090SC1 Overview

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