Description:D2PAK-7L package for low common source inductance; 18V to 20V Gate Drive; New 1700V M1 technology: 28mohm RDS(ON) with low EON and EOFF losses; 100% Avalanche Tested
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and cooling systems.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range.
The NTBG1000N170M1 is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. It's essential to consult with onsemi or a qualified engineer to determine the device's suitability for such applications.
To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits or devices in the system design.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NTBG1000N170M1 Overview
Use the download button to access the NTBG1000N170M1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTBG1,
or try a keyword search, such as Power Field-Effect Transistors
