The recommended land pattern for NTCDP3SG562HXBBAA is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Additionally, ensure good airflow around the component and avoid blocking the airflow with nearby components.
The maximum operating temperature range for NTCDP3SG562HXBBAA is -40°C to +125°C, with a derating of 1.25% per °C above 80°C.
Yes, NTCDP3SG562HXBBAA is designed to withstand high-vibration environments. However, it is recommended to follow the recommended mounting and soldering procedures to ensure the component's reliability.
To ensure the reliability of NTCDP3SG562HXBBAA in a humid environment, it is recommended to apply a conformal coating to the PCB, and to follow the recommended storage and handling procedures to prevent moisture absorption.
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NTCDP3SG562HXBBAA Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
