The recommended land pattern for the NTCS0603E3103FHT is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0603E3103FHT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The maximum operating voltage for the NTCS0603E3103FHT is 25 V. Exceeding this voltage may damage the component.
Store the NTCS0603E3103FHT in a dry, cool place, away from direct sunlight. Use airtight packaging or a dry nitrogen-filled package to prevent moisture absorption.
The recommended reflow soldering profile for the NTCS0603E3103FHT is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
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NTCS0603E3103FHT Overview
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