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NTD360N80S3Z - onsemi

Description: 900 V @ TJ = 150 °C; Ultra Low Gate Charge (Typ. Qg = 25.3 nC); Low Stored Energy in Output Capacitance (Eoss = 2.72 µJ @ 400 V); Optimized Capacitance; ESD Improved Capability with Zener Diode; Typ. RDS(on) = 300 mΩ; RoHS Compliant; 100% Avalanche Tested; Internal Gate Resistance: 4 Ω

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PCB Footprints
NTD360N80S3Z - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE A _2023
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NTD360N80S3Z Details

  • Manufacturer Part Number:

    NTD360N80S3Z

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Manufacturer Package Code:

    369AS

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.7

  • Avalanche Energy Rating (Eas):

    40 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain Current-Max (ID):

    13 A

  • Drain-source On Resistance-Max:

    0.36 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    96 W

  • Pulsed Drain Current-Max (IDM):

    32.5 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTD360N80S3Z Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTD360N80S3Z is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management and cooling. Additionally, perform thorough testing and validation to ensure the device meets the required specifications.
  • Follow the recommended PCB layout guidelines in the datasheet, including keeping the device away from heat sources, using a solid ground plane, and minimizing trace lengths and widths. Consult with a PCB design expert if necessary.
  • Follow proper ESD handling procedures, including using ESD-safe materials, grounding straps, and wrist straps. Ensure that the device is stored in an ESD-safe environment and handled by trained personnel.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider using a thermal pad or thermal tape. Consult with a thermal management expert if necessary.

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NTD360N80S3Z Overview

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