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NTD4804NT4G - onsemi

Description: Single N-Channel Power MOSFET 30V, 117A, 4mΩ

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NTD4804NT4G Details

  • Manufacturer Part Number:

    NTD4804NT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK 4 LEAD Single Gauge Surface Mount

  • Pin Count:

    4

  • Manufacturer Package Code:

    369AA

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    450 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    14.5 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    93.75 W

  • Pulsed Drain Current-Max (IDM):

    230 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTD4804NT4G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTD4804NT4G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and handling procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a robust PCB design, and implementing adequate thermal management and ESD protection.
  • For optimal performance and thermal management, ensure a low-thermal-resistance PCB design, use a thermal pad or heat sink, and maintain a minimum of 1 mm clearance around the device. Also, consider using thermal vias and a thermal interface material (TIM) to improve heat dissipation.
  • Handle the device by the body, avoid touching the leads or die, and store the device in a dry, ESD-protected environment. Use anti-static packaging and follow proper ESD handling procedures to prevent damage.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60 seconds maximum. For rework, use a low-temperature soldering iron (350°C max) and avoid applying excessive heat or force, which can damage the device.

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NTD4804NT4G Overview

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