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NTD4808N-1G - onsemi

Description: Obsolete - Single N-Channel Power MOSFET 30V 63A 8mΩ

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PCB Footprints
NTD4808N-1G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK CASE 369D−01_
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3D Models
NTD4808N-1G - onsemi  - 3D model - Transistor Outline, Vertical - IPAK CASE 369D−01_
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NTD4808N-1G Details

  • Manufacturer Part Number:

    NTD4808N-1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK INSERTION MOUNT

  • Package Description:

    IPAK-3

  • Pin Count:

    4

  • Manufacturer Package Code:

    369

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    144.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    9.8 A

  • Drain-source On Resistance-Max:

    0.0124 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    54.6 W

  • Pulsed Drain Current-Max (IDM):

    126 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTD4808N-1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTD4808N-1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a thermally enhanced package and implementing a robust testing and screening process.
  • Use a multi-layer PCB with a thermal via structure to dissipate heat. Ensure a minimum of 2 oz copper thickness and a thermal conductivity of 1 W/m-K. Keep the component away from heat sources and ensure good airflow.
  • Use a robust PCB design with thick copper traces and a low-impedance path to handle high currents. Ensure proper thermal management and consider using a heat sink or thermal interface material.
  • The NTD4808N-1G has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.

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NTD4808N-1G Overview

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