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NTD5C648NLT4G - onsemi

Description: Low on-resistance; High current capability; RoHS Compliant

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NTD5C648NLT4G - onsemi - PCB symbol
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PCB Footprints
NTD5C648NLT4G - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) TO-252 (369C) ISSUE F
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3D Models
NTD5C648NLT4G - onsemi - 3D model - Other - DPAK (SINGLE GAUGE) TO-252 (369C) ISSUE F
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NTD5C648NLT4G Details

  • Manufacturer Part Number:

    NTD5C648NLT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    62 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    223 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    91 A

  • Drain-source On Resistance-Max:

    0.0057 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    28 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    76 W

  • Pulsed Drain Current-Max (IDM):

    550 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTD5C648NLT4G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTD5C648NLT4G is -40°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • The recommended PCB layout should include a solid ground plane, and thermal vias should be used to dissipate heat. A heat sink or thermal interface material can also be used to improve thermal performance. Consult the onsemi application note for more detailed guidance.
  • To troubleshoot issues, first verify that the device is operated within its specified voltage and current ratings. Check for proper PCB layout and thermal management. Use a thermal imaging camera or thermocouple to monitor the device temperature. Consult the onsemi application note and datasheet for more guidance.
  • The NTD5C648NLT4G has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures. Latch-up prevention measures include using a latch-up immune design and following the recommended operating conditions.

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NTD5C648NLT4G Overview

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