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NTGS3443T1G - onsemi

Description: Ultra Low RDS(on); Miniature TSOP6 Surface Mount Package; Higher Efficiency Extending Battery Life; RoHS Compliant

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PCB Footprints
NTGS3443T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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3D Models
NTGS3443T1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02
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NTGS3443T1G Details

  • Manufacturer Part Number:

    NTGS3443T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2.2 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    100 ns

  • Turn-on Time-Max (ton):

    70 ns

NTGS3443T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Keep the device away from noise sources, use a solid ground plane, and ensure a low-impedance path to ground. Use shielded cables and connectors, and consider adding EMI filters or chokes if necessary.
  • Use a low-dropout linear regulator or a switching regulator with a high power conversion efficiency. Optimize the system's power management scheme, and consider using power gating or dynamic voltage and frequency scaling.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Employ a high-bandwidth oscilloscope and a current probe for transient analysis. Consider using a thermal imaging camera for thermal characterization.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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NTGS3443T1G Overview

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