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NTH4L045N065SC1 - onsemi

Description: 650V rated; Max RDS(on) = 52.8 mΩ at Vgs = 18V, Id = 20A; Max Junction Temperature 175°C; 100% UIL Tested; RoHS Compliant; High Speed Switching and Low Capacitance

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PCB Footprints
NTH4L045N065SC1 - onsemi PCB footprint - Other - Other - TO−247−4LD_2023
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NTH4L045N065SC1 - onsemi  - 3D model - Other - TO−247−4LD_2023
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NTH4L045N065SC1 Details

  • Manufacturer Part Number:

    NTH4L045N065SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-4

  • Manufacturer Package Code:

    340CJ

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    72 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    55 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    14 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    187 W

  • Pulsed Drain Current-Max (IDM):

    197 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

NTH4L045N065SC1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power handling capabilities. Additionally, ensure that the PCB is designed to minimize thermal resistance and that the device is properly soldered.
  • The NTH4L045N065SC1 has an integrated ESD protection diode, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A human body model (HBM) of 2kV and a machine model (MM) of 200V are recommended for ESD protection.
  • Yes, the NTH4L045N065SC1 is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade devices. However, it's essential to follow the recommended operating conditions and ensure that the device is properly validated for the specific application.
  • The recommended soldering conditions for the NTH4L045N065SC1 include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that meets the requirements of IPC J-STD-020. It's essential to follow these conditions to ensure reliable operation and prevent damage to the device.

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NTH4L045N065SC1 Overview

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