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NTHL020N090SC1 - onsemi

Description: 900V Rating; High Junction Temperature; Ultra Low Gate Charge; 100% UIL Tested; RoHS Compliant

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PCB Footprints
NTHL020N090SC1 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−3LD CASE 340CX
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3D Models
NTHL020N090SC1 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−3LD CASE 340CX
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NTHL020N090SC1 Details

  • Manufacturer Part Number:

    NTHL020N090SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3LD

  • Manufacturer Package Code:

    340CX

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-10-28

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    264 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    900 V

  • Drain Current-Max (ID):

    118 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    24 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    503 W

  • Pulsed Drain Current-Max (IDM):

    472 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

NTHL020N090SC1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTHL020N090SC1 is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure proper thermal management. Additionally, consider using a robust design, such as a redundant system, and implementing failure detection and correction mechanisms.
  • For optimal thermal performance, use a multi-layer PCB with a thermal via structure, and ensure a sufficient copper area for heat dissipation. Also, consider using a heat sink or thermal interface material to improve heat transfer.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and storage procedures. Additionally, consider implementing ESD protection circuits in the system design.
  • Perform thorough testing and validation of the device, including electrical characterization, thermal testing, and reliability testing. Also, consider using industry-standard testing protocols, such as AEC-Q101, to ensure compliance with automotive reliability standards.

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NTHL020N090SC1 Overview

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