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NTHS5404T1G - onsemi

Description: Low RDS(on); Logic Level Gate Drive; Miniature ChipFET Surface Mount Package Saves Board Space; Higher Efficiency Extending Battery Life

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PCB Footprints
NTHS5404T1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - ChipFET CASE1206A−03 ISSUE K
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3D Models
NTHS5404T1G - onsemi  - 3D model - SO Transistor Flat Lead - ChipFET CASE1206A−03 ISSUE K
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NTHS5404T1G Details

  • Manufacturer Part Number:

    NTHS5404T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ChipFET

  • Package Description:

    CHIPFET-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    1206A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.2 A

  • Drain-source On Resistance-Max:

    0.03 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XDSO-C8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.7 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTHS5404T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, use a suitable thermal interface material (TIM) and follow proper mounting and soldering techniques to minimize thermal resistance.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the input voltage below 5V.
  • Use proper ESD protection measures during handling and assembly, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • A 10nF to 100nF input capacitance is recommended to filter out high-frequency noise and ensure stable operation.

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NTHS5404T1G Overview

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