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NTLJS3113PT1G - onsemi

Description: Obsolete - Single P-Channel Power MOSFET -20V -7.7A 40 mΩ

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NTLJS3113PT1G - onsemi - PCB symbol
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PCB Footprints
NTLJS3113PT1G - onsemi PCB footprint - Other - Other - NTLJS3113PT1G-3
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NTLJS3113PT1G - onsemi - 3D model - Other - NTLJS3113PT1G-3
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NTLJS3113PT1G Details

  • Manufacturer Part Number:

    NTLJS3113PT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN6, 2 x 2 x 0.75 mm, 0.65 mm Pitch

  • Package Description:

    WDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    506AP

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.9 W

  • Pulsed Drain Current-Max (IDM):

    23 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTLJS3113PT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below 125°C. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
  • The NTLJS3113PT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or container.
  • Yes, the NTLJS3113PT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using automotive-grade processes. However, additional testing and validation may be required for specific applications.
  • Use a soldering temperature of 260°C (max) for a maximum of 10 seconds. Ensure that the device is not exposed to temperatures above 260°C for more than 5 seconds. Follow the recommended soldering profile and use a solder with a melting point below 220°C.

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NTLJS3113PT1G Overview

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