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NTMD4184PFR2G - onsemi

Description: FETKY™ Surface Mount Package Saves Board Space; Independent Pin-Out for MOSFET and Schottky Allowing forDesign Flexibility; Low RDS(on) MOSFET and Low VF Schottky to MinimizeConduction Losses; Optimized Gate Charge to Minimize Switching Losses

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NTMD4184PFR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 NB_
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NTMD4184PFR2G - onsemi  - 3D model - Small Outline Packages - SOIC−8 NB_
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NTMD4184PFR2G Details

  • Manufacturer Part Number:

    NTMD4184PFR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.3 A

  • Drain-source On Resistance-Max:

    0.095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.31 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMD4184PFR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it's recommended to operate the device within the specified voltage and current ratings to ensure reliability and prevent damage.
  • Yes, the NTMD4184PFR2G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within its specified ratings and follows the recommended application guidelines.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to handle the device by the body or use an ESD wrist strap to prevent damage.

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NTMD4184PFR2G Overview

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