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NTMFD5C650NLT1G - onsemi

Description: Low on resistance; High current capability; 100% avalanche tested; Pb-Free; Small footprint (5x6 mm)

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PCB Footprints
NTMFD5C650NLT1G - onsemi PCB footprint - Other - Other - DFN8 5x6, 1.27P Dual Flag (SO8FL−Dual) CASE 506BT ISSUE F_2023AD
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3D Models
NTMFD5C650NLT1G - onsemi  - 3D model - Other - DFN8 5x6, 1.27P Dual Flag (SO8FL−Dual) CASE 506BT ISSUE F_2023AD
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NTMFD5C650NLT1G Details

  • Manufacturer Part Number:

    NTMFD5C650NLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SO-8FL Dual / DFN-8

  • Package Description:

    SO-8FL, DFN-8

  • Manufacturer Package Code:

    506BT

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    186 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.0058 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    17 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    502 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMFD5C650NLT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-3 layer board with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently. Additionally, keeping the component placement and routing symmetrical can help reduce thermal gradients.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink. Additionally, derating the device's power dissipation and using a thermal protection circuit can help prevent overheating.
  • Using a different gate driver IC than the one recommended in the datasheet may affect the performance and reliability of the NTMFD5C650NLT1G. The recommended gate driver is optimized for the device's specific characteristics, and using a different driver may result in suboptimal switching performance, increased power losses, or even damage to the device. It's essential to evaluate the compatibility and performance of the alternative gate driver IC before implementation.
  • To troubleshoot and debug issues related to the device's internal temperature monitoring and protection features, use a logic analyzer or oscilloscope to monitor the device's thermal monitoring pins and fault flags. Check the device's datasheet and application notes for specific guidance on interpreting the thermal monitoring signals and fault flags. Additionally, consult onsemi's technical support resources and application notes for troubleshooting and debugging techniques.
  • When using the NTMFD5C650NLT1G in a parallel configuration, it's essential to ensure that the devices are properly matched, and the gate drive signals are synchronized to prevent shoot-through currents and uneven current sharing. Additionally, consider the impact of parasitic inductances and resistances on the overall system performance, and take measures to minimize them. Consult onsemi's application notes and technical support resources for guidance on parallel configuration and layout considerations.

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