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NTMFS002P03P8ZT1G - onsemi

Description: Ultra Low RDS(on); Advanced Package Technology in 5x6mm; Pb−Free and Halogen Free/BFR Free

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NTMFS002P03P8ZT1G - onsemi PCB footprint - Other - Other - NTMFS002P03P8ZT1G-3
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NTMFS002P03P8ZT1G Details

  • Manufacturer Part Number:

    NTMFS002P03P8ZT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5x6, 1.27P (SO−8FL)

  • Package Description:

    SO-8FL, DFN5, 5 PIN

  • Manufacturer Package Code:

    506EZ

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    212.3 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    34.6 A

  • Drain-source On Resistance-Max:

    0.0017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4880 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    138.9 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS002P03P8ZT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTMFS002P03P03P8ZT1G is a 2.5mm x 2.5mm pad with a 1.5mm x 1.5mm thermal pad in the center, and a 0.5mm keep-out zone around the device.
  • To ensure reliable operation in high-temperature environments, ensure that the device is properly mounted on a heat sink, and that the thermal interface material is applied correctly. Also, ensure that the device is operated within the recommended temperature range of -40°C to 150°C.
  • The maximum allowed voltage on the gate of NTMFS002P03P03P8ZT1G is 20V. Exceeding this voltage may damage the device.
  • To protect NTMFS002P03P03P8ZT1G from ESD, handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded.
  • The recommended storage condition for NTMFS002P03P03P8ZT1G is in a dry, cool place, away from direct sunlight, with a relative humidity of 60% or less, and a temperature range of -40°C to 30°C.

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NTMFS002P03P8ZT1G Overview

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