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NTMFS015N10MCLT1G - onsemi

Description: Small Footprint (5x6 mm); Low On-Resistance; Low Capacitance; RoHS Compliant

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PCB Footprints
NTMFS015N10MCLT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2022-2
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NTMFS015N10MCLT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE N_2022-2
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NTMFS015N10MCLT1G Details

  • Manufacturer Part Number:

    NTMFS015N10MCLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2019-01-22

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    54 A

  • Drain-source On Resistance-Max:

    0.0122 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    79 W

  • Pulsed Drain Current-Max (IDM):

    423 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS015N10MCLT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTMFS015N10MCLT1G is a 5-pin SOT-23 package with a 1.3mm x 1.3mm body size. The recommended land pattern is available in the onsemi packaging specifications document.
  • To ensure reliability in high-temperature applications, follow the recommended derating guidelines for the device, ensure proper thermal management, and consider using a thermal interface material to improve heat transfer between the device and the PCB.
  • The maximum allowed voltage on the gate of NTMFS015N10MCLT1G is 12V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, NTMFS015N10MCLT1G can be used in switching applications, but ensure that the device is operated within its specified switching frequency and voltage ratings to avoid overheating and premature failure.
  • To calculate the power dissipation of NTMFS015N10MCLT1G, use the equation Pd = (Vds x Ids) + (Vgs x Igs), where Pd is the power dissipation, Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.

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