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NTMFS0D5N03CT1G - onsemi

Description: Ultra Low RDS(on); These Devices are Pb−Free, Halogen Free/BFR Free; Advanced Package (5x6mm)

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NTMFS0D5N03CT1G Details

  • Manufacturer Part Number:

    NTMFS0D5N03CT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5x6, 1.27P (SO−8FL)

  • Package Description:

    SO-8FL, DFN5, 8 PIN

  • Manufacturer Package Code:

    506EZ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2020-03-17

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    467 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    462 A

  • Drain-source On Resistance-Max:

    0.00075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    320 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    187 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS0D5N03CT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, using multiple vias under the thermal pad can further improve heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal design, including a suitable heat sink and thermal interface material, is also crucial. Additionally, consider using a thermal monitoring system to detect potential overheating issues.
  • The NTMFS0D5N03CT1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded. Avoid touching the device pins or exposing them to static electricity.
  • Yes, the NTMFS0D5N03CT1G is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications. However, it's essential to follow the recommended operating conditions and ensure that the device is properly validated for the specific application.
  • The suitable gate drive voltage for the NTMFS0D5N03CT1G depends on the specific application and operating conditions. As a general guideline, a gate drive voltage of 10-15V is recommended. However, it's essential to consult the datasheet and application notes for more detailed information and to ensure that the gate drive voltage is within the recommended range.

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NTMFS0D5N03CT1G Overview

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