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NTMFS0D7N03CGT1G - onsemi

Description: Wide SOA; Ultra Low RDS(on); Advanced SO8-FL 5x6mm Package Technology

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NTMFS0D7N03CGT1G Details

  • Manufacturer Part Number:

    NTMFS0D7N03CGT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5x6, 1.27P (SO−8FL)

  • Manufacturer Package Code:

    506EZ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    1080 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    409 A

  • Drain-source On Resistance-Max:

    0.00065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    88 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    187 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS0D7N03CGT1G Frequently Asked Questions (FAQs)

  • The NTMFS0D7N03CGT1G has an operating temperature range of -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and ensure the device is operated within the specified voltage and current ranges.
  • For optimal thermal performance, use a multi-layer PCB with thermal vias, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet and application notes.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure the device is stored in an ESD-protected environment. The NTMFS0D7N03CGT1G has built-in ESD protection, but additional precautions are still necessary.
  • The NTMFS0D7N03CGT1G meets the quality and reliability standards outlined in the onsemi quality manual, including AEC-Q101 and ISO/TS 16949 certifications.

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NTMFS0D7N03CGT1G Overview

Use the download button to access the NTMFS0D7N03CGT1G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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