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NTMFS1D7N03CGT1G - onsemi

Description: Wide SOA; Low RDS(on); Advanced SO8-FL 5x6mm Package Technology

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NTMFS1D7N03CGT1G Details

  • Manufacturer Part Number:

    NTMFS1D7N03CGT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 5 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2020-10-06

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    128 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    170 A

  • Drain-source On Resistance-Max:

    0.00174 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    87 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS1D7N03CGT1G Frequently Asked Questions (FAQs)

  • The NTMFS1D7N03CGT1G has an operating temperature range of -55°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and ensure the device is operated within the specified voltage and current ranges.
  • For optimal thermal performance, use a multi-layer PCB with a thermal pad connected to a heat sink or a thermal via. Ensure good thermal conductivity and minimal thermal resistance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge.
  • Follow the recommended soldering temperature and time guidelines in the datasheet, and ensure proper handling and storage to prevent damage during assembly.

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NTMFS1D7N03CGT1G Overview

Use the download button to access the NTMFS1D7N03CGT1G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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