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NTMFS5C460NLT3G - onsemi

Description: Low RDS(on); Low Input Capacitance; Maximum Junction Temperature of 175°C; RoHS Compliant

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NTMFS5C460NLT3G Details

  • Manufacturer Part Number:

    NTMFS5C460NLT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN-5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    107 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    78 A

  • Drain-source On Resistance-Max:

    0.0072 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    520 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFS5C460NLT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet. Typically, this involves setting the VCC voltage to 5V, the VGS voltage to 0V, and the ID current to the recommended value. Also, make sure to use a suitable gate resistor and a decoupling capacitor to minimize noise and oscillations.
  • Critical parameters to monitor during device operation include the drain-source voltage (VDS), drain current (ID), gate-source voltage (VGS), and junction temperature (TJ). Monitoring these parameters helps prevent device damage, ensures optimal performance, and allows for early detection of potential issues.
  • To handle ESD protection, follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. During PCB design, include ESD protection diodes or resistors in the circuit, and ensure that the device is properly grounded. Additionally, consider using ESD-protected devices or adding external ESD protection components.
  • The NTMFS5C460NLT3G has a typical lifetime of 10-15 years, depending on operating conditions and environmental factors. To ensure reliability, follow the recommended operating conditions, handle the device with care, and store it in a clean, dry environment. Regularly monitoring device parameters and performing maintenance can also help extend its lifetime.

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NTMFS5C460NLT3G Overview

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