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NTMFS6H800NT1G - onsemi

Description: Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; RoHS Compliant

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PCB Footprints
NTMFS6H800NT1G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 506EZ ISSUE A
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3D Models
NTMFS6H800NT1G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 506EZ ISSUE A
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NTMFS6H800NT1G Details

  • Manufacturer Part Number:

    NTMFS6H800NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5x6, 1.27P (SO−8FL)

  • Package Description:

    SO-8FL, DFN5, 8 PIN

  • Manufacturer Package Code:

    506EZ

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    1271 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    203 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    27 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    200 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMFS6H800NT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTMFS6H800NT1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a robust PCB design, and follow proper soldering and assembly techniques.
  • The recommended land pattern for the NTMFS6H800NT1G can be found in the onsemi application note AND9001/D, which provides guidelines for PCB layout and assembly.
  • Yes, the NTMFS6H800NT1G is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB design and layout guidelines to minimize parasitic effects and ensure optimal performance.
  • To prevent ESD damage, handle the NTMFS6H800NT1G with ESD-protective equipment, such as wrist straps and mats. Ensure that the device is stored in an ESD-protective package, and follow proper handling and assembly procedures.

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NTMFS6H800NT1G Overview

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