Description:100% UIL Tested; RoHS Compliant; Dual Cool™ Top Side Cooling PQFN package; Max rDS(on) = 10 mΩ at VGS = 10 V, ID = 10 A; High performance technology for extremely low rDS(on)
A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
The recommended soldering conditions for the NTMFSC011N08M7 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
Yes, the NTMFSC011N08M7 is qualified for automotive and high-reliability applications, but it's essential to follow the recommended operating conditions, and to consult with onsemi's application notes and reliability reports for specific guidance.
To handle ESD protection during handling and assembly, it's recommended to follow standard ESD handling procedures, use ESD-protective packaging and materials, and to ground all personnel and equipment before handling the device.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
NTMFSC011N08M7 Overview
Use the download button to access the NTMFSC011N08M7 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like NTMFS,
or try a keyword search, such as Power Field-Effect Transistors
