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NTMFSC1D6N06CTWG - onsemi

Description: Advanced Dual−sided Cooled Packaging; Low RDS(on); Low QG and Capacitance

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PCB Footprints
NTMFSC1D6N06CTWG - onsemi PCB footprint - Other - Other - DFN8 5x6.15, 1.27P, DUAL COOL CASE 506EG ISSUE D
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3D Models
NTMFSC1D6N06CTWG - onsemi  - 3D model - Other - DFN8 5x6.15, 1.27P, DUAL COOL CASE 506EG ISSUE D
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NTMFSC1D6N06CTWG Overview

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