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NTMFSS0D9N03P8 - onsemi

Description: Low RDS(on) with Source-Down Technologies; Low QG and Capacitance; RoHS Compliant

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PCB Footprints
NTMFSS0D9N03P8 - onsemi PCB footprint - Other - Other - TDFN9 5x6, 1.27P CASE 520AE ISSUE B
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NTMFSS0D9N03P8 - onsemi  - 3D model - Other - TDFN9 5x6, 1.27P CASE 520AE ISSUE B
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NTMFSS0D9N03P8 Details

  • Manufacturer Part Number:

    NTMFSS0D9N03P8

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN9 5x6, 1.27P

  • Package Description:

    DFN-8

  • Manufacturer Package Code:

    520AE

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2020-06-16

  • Manufacturer:

    onsemi

  • YTEOL:

    5.3

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    43 A

  • Drain-source On Resistance-Max:

    0.0012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    370 pF

  • JESD-30 Code:

    R-PTSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    121 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    TRIPLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

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NTMFSS0D9N03P8 Overview

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