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NTMFSS1D5N06CL - onsemi

Description: Low RDS(on) to Minimize Conduction Losses; Low QG and Capacitance to Minimize Driver Losses; Small Footprint (5x6 mm) for Compact Design; These Devices are Pb−Free, Halogen−Free / BFR Free and are RoHS Compliant

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PCB Footprints
NTMFSS1D5N06CL - onsemi PCB footprint - Other - Other - TDFN9 5x6, 1.27P CASE 520AE ISSUE B
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NTMFSS1D5N06CL - onsemi  - 3D model - Other - TDFN9 5x6, 1.27P CASE 520AE ISSUE B
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NTMFSS1D5N06CL Details

  • Manufacturer Part Number:

    NTMFSS1D5N06CL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN9 5x6, 1.27P

  • Package Description:

    TDFN9, 8 PIN

  • Manufacturer Package Code:

    520AE

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    207 mJ

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    237 A

  • Drain-source On Resistance-Max:

    0.0023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    42 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    144 W

  • Pulsed Drain Current-Max (IDM):

    1698 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMFSS1D5N06CL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a copper pour on the top and bottom layers, and connecting the thermal pad to the copper pour using vias. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • The NTMFSS1D5N06CL has an integrated ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NTMFSS1D5N06CL is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is designed to operate in harsh environments. However, it's essential to follow the recommended operating conditions and ensure that the device is properly validated for the specific application.
  • The suitable gate resistor value depends on the specific application requirements, including the switching frequency, voltage, and current. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or seek guidance from an onsemi representative for a more accurate calculation.

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NTMFSS1D5N06CL Overview

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