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NTMJST2D6N08HTXG - onsemi

Description: Top Side Cooling; Ultra Low RDS(on); Small Footprint, 5x7 mm; Pb-Free

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PCB Footprints
NTMJST2D6N08HTXG - onsemi PCB footprint - Other - Other - TCPAK10 5.1x7.5, 1.0P CASE 760AG ISSUE D
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3D Models
NTMJST2D6N08HTXG - onsemi  - 3D model - Other - TCPAK10 5.1x7.5, 1.0P CASE 760AG ISSUE D
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NTMJST2D6N08HTXG Details

  • Manufacturer Part Number:

    NTMJST2D6N08HTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TCPAK10 5.1x7.5, 1.0P

  • Manufacturer Package Code:

    760AG

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    757 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    131.5 A

  • Drain-source On Resistance-Max:

    0.0028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JESD-30 Code:

    R-PDSO-G10

  • Number of Elements:

    1

  • Number of Terminals:

    10

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    116 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

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NTMJST2D6N08HTXG Overview

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