Part Image

NTMS4937NR2G - onsemi

Description: Obsolete - Single N-Channel Power MOSFET 30V, 12.5A, 8.4mΩ

Download NTMS4937NR2G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NTMS4937NR2G - onsemi PCB footprint - Other - Other - SOIC−8 NB CASE 751−07 ISSUE AK
click to zoom
3D Models
NTMS4937NR2G - onsemi  - 3D model - Other - SOIC−8 NB CASE 751−07 ISSUE AK
click to zoom

NTMS4937NR2G Details

  • Manufacturer Part Number:

    NTMS4937NR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8NB, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    84.5 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8.6 A

  • Drain-source On Resistance-Max:

    0.0065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.36 W

  • Pulsed Drain Current-Max (IDM):

    112 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMS4937NR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path short and direct to the heat sink or thermal pad.
  • To ensure reliable operation at high temperatures, follow the recommended operating conditions, use a suitable heat sink, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the NTMS4937NR2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C.
  • While the NTMS4937NR2G is not specifically designed for high-humidity environments, it can still be used with proper precautions such as conformal coating, hermetic sealing, or using moisture-resistant packaging.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback network, and ensure that the device is properly configured and compensated according to the datasheet.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NTMS4937NR2G Overview

Use the download button to access the NTMS4937NR2G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTMS4, or try a keyword search, such as Power Field-Effect Transistors

Parts related to NTMS4937NR2G

Showing 0 results