FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS
Application:
EFFICIENCY
Breakdown Voltage-Min:
120 V
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.91 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e3
Non-rep Pk Forward Current-Max:
250 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
20 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Rep Pk Reverse Voltage-Max:
120 V
Reverse Current-Max:
500 µA
Reverse Test Voltage:
120 V
Surface Mount:
NO
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
NTST40120CTG Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
The SOA is not explicitly stated in the datasheet. However, it can be estimated by considering the device's voltage, current, and power ratings. Consult with onsemi's application engineers for specific guidance.
Yes, the NTST40120CTG is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
Follow proper ESD handling procedures during assembly and storage. Use ESD-protective packaging and handling equipment. The device itself has some ESD protection built-in, but additional external protection may be necessary.
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NTST40120CTG Overview
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