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NTSV20120CTG - onsemi

Description: Obsolete - Schottky Power Rectifier, Dual, 20 A, 80 V

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PCB Footprints
NTSV20120CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 CASE 221A-09 ISSUE AH
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3D Models
NTSV20120CTG - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 CASE 221A-09 ISSUE AH
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NTSV20120CTG Details

  • Manufacturer Part Number:

    NTSV20120CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 3 LEAD STANDARD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 221A-09, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    221A

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    120 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.12 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    700 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NTSV20120CTG Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the device away from heat sources. A heat sink or thermal pad can be used to improve heat dissipation. Consult onsemi's application notes and thermal management guidelines for more information.
  • Follow onsemi's recommended operating conditions, use a heat sink or thermal pad, and ensure good airflow. Consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection if necessary.
  • The NTSV20120CTG has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap, mat, or workstation, and avoid touching the device's pins or exposed pads. Follow onsemi's ESD handling guidelines for more information.
  • The NTSV20120CTG is a commercial-grade device, but onsemi offers automotive-grade and high-reliability versions of similar devices. Consult onsemi's product portfolio and application notes for more information on suitable devices for your specific application.
  • Consult onsemi's troubleshooting guides and application notes, and perform basic checks such as verifying the power supply, signal integrity, and PCB layout. Use oscilloscopes or logic analyzers to debug the device's behavior. If issues persist, contact onsemi's technical support for further assistance.

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NTSV20120CTG Overview

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