HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 221A-09, 3 PIN
Pin Count:
3
Manufacturer Package Code:
221A
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
onsemi
YTEOL:
0
Additional Feature:
FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS
Application:
EFFICIENCY
Breakdown Voltage-Min:
120 V
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.18 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e3
Non-rep Pk Forward Current-Max:
100 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
15 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Rep Pk Reverse Voltage-Max:
120 V
Reverse Current-Max:
800 µA
Reverse Test Voltage:
120 V
Surface Mount:
NO
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
NTSV30120CTG Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
The recommended soldering profile for the NTSV30120CTG is a reflow profile with a peak temperature of 260°C, a dwell time above 217°C of 30-60 seconds, and a ramp rate of 3°C/s. It's also recommended to use a solder with a melting point above 217°C.
To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap, ESD mat, or ESD chair. Additionally, ensure that all equipment and tools are properly grounded, and handle the device by the body or leads, avoiding direct contact with the pins.
The recommended storage and handling conditions for the NTSV30120CTG include storing the device in its original packaging, in a dry, cool place, away from direct sunlight and moisture. Avoid bending, flexing, or twisting the leads, and handle the device with clean, dry gloves or a vacuum pick-up tool.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NTSV30120CTG Overview
Use the download button to access the NTSV30120CTG schematic symbol, PCB footprint, and 3D model.
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