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NTSX2102GDH - NXP

Description: Translation - Voltage Levels 2-bit Dual Supply Translating Transcvr

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PCB Footprints
NTSX2102GDH - NXP PCB footprint - Other - Other - NTSX2102GDH-3
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3D Models
NTSX2102GDH - NXP  - 3D model - Other - NTSX2102GDH-3
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NTSX2102GDH Details

  • Manufacturer Part Number:

    NTSX2102GDH

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    So-6

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT996-2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    SEATED HGT-NOM

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    NTSX2102

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.006 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    12 ns

  • Propagation Delay (tpd):

    12 ns

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

NTSX2102GDH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management strategy, such as heat sinks or thermal interfaces, to keep the junction temperature below 150°C. Also, ensure proper PCB design and component selection for high-temperature operation.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering. Ensure the capacitors are placed close to the device and have a low ESL (Equivalent Series Inductance).
  • Use a shielded enclosure, keep the device away from antennas and high-frequency components, and ensure proper PCB layout and grounding. Implement EMI filters or common-mode chokes if necessary.
  • Power up the device in the following sequence: VIN, VCC, and then enable the output. Power down in the reverse sequence. Ensure a minimum of 10ms delay between power-up and power-down sequences.

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NTSX2102GDH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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