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NTSX2102GU8H - NXP

Description: Voltage Level Translator Bidirectional 1 Circuit 2 Channel 50Mbps 8-XQFN (1.4x1.2)

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PCB Footprints
NTSX2102GU8H - NXP PCB footprint - Other - Other - SOT1309-1 (XQFN8)
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3D Models
NTSX2102GU8H - NXP  - 3D model - Other - SOT1309-1 (XQFN8)
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NTSX2102GU8H Details

  • Manufacturer Part Number:

    NTSX2102GU8H

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XQFN-8

  • Pin Count:

    QFN

  • Manufacturer Package Code:

    SOT1309-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    NTSX2102

  • JESD-30 Code:

    R-PQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    1.4 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.006 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    12 ns

  • Propagation Delay (tpd):

    12 ns

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

NTSX2102GU8H Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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NTSX2102GU8H Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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