SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
54 A
Drain-source On Resistance-Max:
0.0054 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
25 pF
JEDEC-95 Code:
MO-220WEEC-1
JESD-30 Code:
S-PQCC-N12
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
20 W
Pulsed Drain Current-Max (IDM):
408 A
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
NTTFD4D1N03P1E Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a copper plane on the PCB, and using vias to dissipate heat to other layers. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material (TIM) to fill any gaps.
The NTTFD4D1N03P1E has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
Yes, the NTTFD4D1N03P1E is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is qualified according to the relevant industry standards (e.g., AEC-Q101).
The recommended soldering conditions for the NTTFD4D1N03P1E involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less. Ensure that the device is not exposed to temperatures above 260°C (500°F) for an extended period.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NTTFD4D1N03P1E Overview
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