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NTTFS010N10MCLTAG - onsemi

Description: MOSFET - Power, N-Channel, Shielded Gate, POWERTRENCH, 100 V, 50 A, 10.6 m

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PCB Footprints
NTTFS010N10MCLTAG - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511DY ISSUE A
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3D Models
NTTFS010N10MCLTAG - onsemi  - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511DY ISSUE A
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NTTFS010N10MCLTAG Details

  • Manufacturer Part Number:

    NTTFS010N10MCLTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511DY

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0106 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    18 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    52 W

  • Pulsed Drain Current-Max (IDM):

    250 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    55 ns

  • Turn-on Time-Max (ton):

    29 ns

NTTFS010N10MCLTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30 seconds, and time above 183°C 60 seconds. Use a solder with a melting point above 217°C.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that the workstation is ESD-protected. Store the device in an anti-static bag or container.
  • Store the device in a dry, cool place (temperature range: -40°C to 30°C, humidity < 60%). Avoid exposure to direct sunlight, moisture, or contaminants.

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NTTFS010N10MCLTAG Overview

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