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NTTFS030N06CTAG - onsemi

Description: Small Footprint (3.3 x 3.3 mm); Low RDS(on); Low QG and Capacitance; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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NTTFS030N06CTAG - onsemi PCB footprint - Other - Other - NTTFS030N06CTAG-2
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NTTFS030N06CTAG - onsemi  - 3D model - Other - NTTFS030N06CTAG-2
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NTTFS030N06CTAG Details

  • Manufacturer Part Number:

    NTTFS030N06CTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8 / u8FL

  • Package Description:

    WDFN-8

  • Manufacturer Package Code:

    511AB

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2020-01-21

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    19 A

  • Drain-source On Resistance-Max:

    0.0297 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4.4 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    23 W

  • Pulsed Drain Current-Max (IDM):

    86 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTTFS030N06CTAG Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTTFS030N06CTAG is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, use a suitable thermal interface material, and ensure good airflow around the device.
  • Yes, the NTTFS030N06CTAG can be used in switching applications, but it is essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
  • The maximum allowed voltage for the NTTFS030N06CTAG is 30V, but it is recommended to operate the device at a voltage below 25V to ensure reliable operation and minimize the risk of electrical overstress.
  • The power dissipation of the NTTFS030N06CTAG can be calculated using the formula Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.

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NTTFS030N06CTAG Overview

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