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NTTFS3A08PZTWG - onsemi

Description: Obsolete - 30 V, 32 A, 20 mOhm Single N-Channel Power MOSFET, u8FL

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Symbol
NTTFS3A08PZTWG - onsemi - PCB symbol
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PCB Footprints
NTTFS3A08PZTWG - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_3
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3D Models
NTTFS3A08PZTWG - onsemi - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_3
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NTTFS3A08PZTWG Details

  • Manufacturer Part Number:

    NTTFS3A08PZTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN8 3.3x3.3, 0.65P

  • Pin Count:

    8

  • Manufacturer Package Code:

    511AB

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    22 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    4.9 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NTTFS3A08PZTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
  • Implement EOS protection circuits, such as TVS diodes or zener diodes, to protect against voltage transients and surges. Ensure proper PCB layout and component selection.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use anti-static packaging and handling procedures.

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NTTFS3A08PZTWG Overview

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