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NTTFS5820NLTAG - onsemi

Description: Low RDS(on); Low Capacitance; Optimized Gate Charge; RoHS Compliant

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PCB Footprints
NTTFS5820NLTAG - onsemi PCB footprint - Other - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_2
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3D Models
NTTFS5820NLTAG - onsemi  - 3D model - Other - WDFN8 3.3x3.3, 0.65P CASE 511AB ISSUE D_2
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NTTFS5820NLTAG Details

  • Manufacturer Part Number:

    NTTFS5820NLTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFN8 3.3x3.3, 0.65P

  • Package Description:

    WDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    511AB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    71 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    48 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.0115 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    33 W

  • Pulsed Drain Current-Max (IDM):

    149 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTTFS5820NLTAG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a 50-ohm microstrip transmission line for the RF output.
  • Use a thermal pad or thermal interface material to improve heat transfer between the device and the PCB. Ensure good airflow and avoid blocking the thermal pad. Operate the device within the specified temperature range of -40°C to 125°C.
  • The recommended input power level is 0 dBm to 10 dBm. Exceeding the maximum input power can cause damage to the device.
  • Use a low-power mode by setting the enable pin (EN) to low. Reduce the operating frequency and use a low-power oscillator. Optimize the PCB layout to minimize power consumption.
  • Use a human-body model (HBM) ESD protection of at least 2 kV and a machine model (MM) ESD protection of at least 200 V. Implement ESD protection on the PCB using ESD diodes or ESD arrays.

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NTTFS5820NLTAG Overview

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