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NTUD3169CZT5G - onsemi

Description: Complementary MOSFET Device; Offers a Low RDS(on) Solution in the Ultra Small 1.0 x 1.0 mm Package; 1.5 V Gate Voltage Rating; Ultra Thin Profile (< 0.5 mm)

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NTUD3169CZT5G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - NTUD3169CZT5G
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NTUD3169CZT5G Details

  • Manufacturer Part Number:

    NTUD3169CZT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-963 1x1, 0.35P

  • Package Description:

    1 X 1 MM, LEAD FREE, ULTRA SMALL, CASE 527AD-01, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    527AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.22 A

  • Drain-source On Resistance-Max:

    1.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTUD3169CZT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. It's essential to ensure the device operates within the recommended temperature range.
  • Yes, the NTUD3169CZT5G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper power supply, decoupling, and layout. Use oscilloscopes and logic analyzers to debug the issue. If necessary, contact onsemi's technical support for further assistance.

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NTUD3169CZT5G Overview

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