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NUD3160DMT1G - onsemi

Description: Provides Robust Interface between DC Relay Coils and Sensitive Logic; Capable of Driving Relay Coils Rated up to 150 mA at 12 V, 24 V or 48 V; Replaces 3 or 4 Discrete Components for Lower Cost ; Internal Zener Eliminates Need for Free-Wheeling Diode ; Meets Load Dump and other Automotive Specs

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PCB Footprints
NUD3160DMT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05
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NUD3160DMT1G - onsemi  - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05
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NUD3160DMT1G Details

  • Manufacturer Part Number:

    NUD3160DMT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    60 V

  • Supply Voltage-Min:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.5 mm

NUD3160DMT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NUD3160DMT1G is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specified parameters.
  • Start by reviewing the datasheet and application notes to ensure that the device is used within its specified parameters. Check the power supply, input signals, and output loads to ensure they are within the recommended ranges. Use oscilloscopes or logic analyzers to debug the issue, and consider consulting with onsemi's technical support team if the issue persists.

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NUD3160DMT1G Overview

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Part Image NUD3160DMT1 onsemi

Buffer/Inverter Based Peripheral Driver, 2 Driver, PDSO6