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NUD3160LT1G - onsemi

Description: Provides Robust Interface between DC Relay Coils and Sensitive Logic; Capable of Driving Relay Coils Rated up to 150 mA at 12 V, 24 V or 48 V; Replaces 3 or 4 Discrete Components for Lower Cost ; Internal Zener Eliminates Need for Free-Wheeling Diode ; Meets Load Dump and other Automotive Specs

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Symbol
NUD3160LT1G - onsemi - PCB symbol
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PCB Footprints
NUD3160LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
NUD3160LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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NUD3160LT1G Details

  • Manufacturer Part Number:

    NUD3160LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.11 mm

  • Supply Voltage-Max:

    60 V

  • Supply Voltage-Min:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

NUD3160LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The NUD3160LT1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV human body model (HBM) and 200V machine model (MM) ESD protection is recommended.
  • Yes, the NUD3160LT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • Start by verifying the power supply voltage and current. Check for proper PCB layout and thermal design. Use a scope or logic analyzer to verify the input and output signals. Consult the datasheet and application notes for specific troubleshooting guidelines.

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NUD3160LT1G Overview

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NUD3160LT1G Alternates

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Part Image NUD3160LT1 onsemi

Buffer/Inverter Based Peripheral Driver, 1 Driver, PDSO3